Difference between revisions of "DeltaDoverD Progress"
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Determine phi region where there is no acceptance ( where should we stop plotting data)? | Determine phi region where there is no acceptance ( where should we stop plotting data)? | ||
+ | iii.) Asymmetry Calculation | ||
+ | a.) Beam Asymmetry Plot | ||
+ | |||
+ | Choose kinematics ( a single theta and phi point )to max our stats and comparison to paper | ||
+ | |||
+ | Histogram the following | ||
+ | |||
+ | 1.) Number of e-pi coincidence events, number of FC counts | ||
+ | 2.) Number of e-pi coincidence events/FC counts | ||
+ | 3.) Number of e-pi coincidence events/FC count/Pt | ||
+ | |||
+ | for groups of runs with h_e,P_t = ++, +-, -+, -- | ||
+ | |||
+ | table with 4 columns of h_e, P_t | ||
+ | table with 3 rows of the above histograms | ||
[http://www.iac.isu.edu/mediawiki/index.php/Delta_D_over_D Go Back] | [http://www.iac.isu.edu/mediawiki/index.php/Delta_D_over_D Go Back] |
Revision as of 11:10, 19 September 2008
9/5/08
1.) SIDIS Analysis
a.) Cross-Section comparison
i.) Calculate absolute cross section for
= 0.5, 1 < Q^2 < 4 GeV^2 , W = 1.45 +/- 0.2 GeV
ii.) Plot
As one can see from histograms of the pion_theta_angle_vs_phi_angle_in_CM_Frame and the electron_theta_angle_vs_phi_angle_in_CM_Frame, the pion and electron acceptance in the region of
is nearly zero(significantly low).
make plots for
.
2.) Detector Construction
4 chambers are built.
TGEM:
Foils have been mounted on the TGEM comparison chamber. Both charge collectors are mounted on the TGEM test detectors. One TGEM test detector has the Thick PC board GEM foils which need much higher HV than the regular GEM foils. The second TGEM test chamber has 3 GEM foils from CERN.
Need a min of 32 1 Meg Ohm resistors to complete the output termination connectors. Need 32 more termination connectors made from 16 wires.
Need to grind down 16, M3 bolts for mounting the GEM foils and TGEM PCboards.
Need 24 washers for GEM foils. Check mounting of the TGEM boards. Look up spacing and HV for the TGEM boards[1], Media:01352098.pdf .
Need to etch 2 cathodes for the TGEm boards.
Qweak:
a.) Need to do final outer footprint machining so there is no interference with the Electron profile of the other octant.
b.) Need to machining back of the chamber for the Charge collector
c.) Need to machine thick frames for the cathode and maybe GEM foils.
d.) Apply electrical insulation to HV distribution boards
e.) Need to mount GEM foils on the Qweak chambers.
3.) SIS3610 I/O software
Objectives: a.) The first step will be to read 16 of the I/O input channel into a CODA data file.
b.) Display the 16 input channels on a GUI. Unfortunately, only 2 of the 16 will be used to read in the GEM output. The GEM output will transfer 128 hit/no hit signals to a single I/O channel in a serial fashion. The data from one I/O channel needs to be decoded according to the data structure described in Figure 8 and 9 of the VFAT manual.
c.) The final task will be to write a multiple trigger function so the I/O can be triggered by several different interrupt trigger signals and label those trigger signals.
Tasks:
Inject a signal into the I/O board input connector and use a Read function from the ROC to determine if the signal is high or low.
9/19/08
1.) SIDIS Analysis
a.) Cross-Section comparison
i.) Calculate absolute cross section for
= 0.5, 1 < Q^2 < 4 GeV^2 , W = 1.45 +/- 0.2 GeV
?
ii.) What is smallest angular coverage of EC (8 degrees?) Determine phi region where there is no acceptance ( where should we stop plotting data)?
iii.) Asymmetry Calculation
a.) Beam Asymmetry Plot
Choose kinematics ( a single theta and phi point )to max our stats and comparison to paper
Histogram the following
1.) Number of e-pi coincidence events, number of FC counts 2.) Number of e-pi coincidence events/FC counts 3.) Number of e-pi coincidence events/FC count/Pt
for groups of runs with h_e,P_t = ++, +-, -+, --
table with 4 columns of h_e, P_t table with 3 rows of the above histograms